Tech companies experiencing supply chain bottlenecks.
| ticker | Company Name | Evidence of supply chain bottlenecks | Bottleneck details | Details | Cause | Item | Source | Market Cap |
|---|---|---|---|---|---|---|---|---|
| $CRWV | CoreWeave, Inc. | Management said “supply chain is immensely difficult” and also noted “everyone gets hit by supply chain problems.” | Bottlenecks tied to bringing “utterly enormous engineering projects” online; company also discussed where “the bottleneck in the market today” sits around power/data center infrastructure. | CoreWeave said supply chain is "immensely difficult" and that everyone gets hit by supply chain problems. It said the near-term bottleneck of growth is on the data-center side, especially delivering infrastructure at scale, and specifically called out that electrical engineers are critical and hard to add quickly. It also said it is focused on ensuring it can get the components needed to deliver infrastructure, with increasing focus on memory. | Operational complexity of large data-center buildouts, shortage of skilled electrical engineers, and persistent supply-demand imbalances for components. | Data-center infrastructure capacity, components, memory, and skilled electrical-engineering labor | Mar 4, 2026 Conference Call | $64.62B |
| $KLAC | KLA Corporation | Management highlighted “critical supply chain,” said investors ask “what's the bottleneck now,” and noted customers/customers’ customers are “supply constrained.” | Tightness tied to ramping capacity to support growth; KLA also said “High-bandwidth memory is a shortage” and discussed component tightness/lead times. | KLA said the bottleneck is moving, but right now it is a memory shortage, specifically high-bandwidth memory. It also said there are not enough fabs, customers are supply constrained, and long procurement cycles for items like glass and volume optics create supply-chain pressure. | Rapid AI-driven demand, insufficient fab capacity, and shortages in high-bandwidth memory; long lead times for critical components like glass/optics. | High-bandwidth memory, fab capacity, glass, and volume-level optics | Mar 12, 2026 Conference Call, Apr 29, 2026 Earnings Call | $226.27B |
| $NXPI | NXP Semiconductors N.V. | CFO explicitly said: “we are seeing bottlenecks, slight bottlenecks in certain parts of the supply chain.” | Bottlenecks are present in specific parts of the supply chain, though characterized as slight. | Management said it is seeing "slight bottlenecks in certain parts of the supply chain" and also said factories supplying different parts of the supply chain are tight, with inflationary costs being passed through if not offset internally. | Tightness in factories supplying parts of the supply chain and related inflationary cost pressure. | Unspecified parts of the supply chain | Apr 28, 2026 Earnings Call | $74.54B |
| $NTNX | Nutanix, Inc. | Management said it is “dealing with a supply chain shortage… with respect to memory,” which is “impeding the pricing and availability of servers in the market.” It also said the “challenging supply environment” is delaying customers’ ability to procure servers. | Explicit issues include memory shortages, server availability constraints, longer lead times, and lack of CPU availability; these delays affect customer procurement and timing of Nutanix software revenue/orders. | Nutanix said supply chain shortages in memory are impeding server pricing and availability, and that longer lead times driven largely by lack of CPU availability have been a bigger challenge than pricing. It also said shortages in CPUs, memory, storage and other components are delaying customers' ability to procure servers, leading to longer server lead times. | Massive AI build-out and industry-wide shortages in memory and CPUs; lack of CPU availability specifically cited as a major driver of longer lead times. | Memory, CPUs, storage, other server components, and servers | Feb 25, 2026 Earnings Call, Mar 2, 2026 Conference Call, Apr 7, 2026 Conference Call | $11.30B |
| $ANET | Arista Networks, Inc. | CEO said: “while we have solved many supply chain issues, I think the one in front of us… is memory.” | Current bottleneck is memory, which became more acute in Q4. | Arista said the supply issue it realized more acutely is memory, with real shortages affecting customers. It attributed this to high adoption of memory in automotive and AI/server markets, and also said power is becoming the biggest scarcity in data-center buildouts. | High adoption of memory in automotive and AI/server markets; power scarcity in data-center expansion. | Memory and power | Mar 3, 2026 Conference Call | $217.46B |
| $AMAT | Applied Materials, Inc. | Management said there were “different pockets of the supply chain that were very difficult to improve” and emphasized the importance of supply chain readiness. | Bottlenecks relate to scaling supplier capacity and labor/training to support significant output growth; company has been reengineering supply chain since COVID. | Applied Materials said the market is constrained in leading-edge semiconductor components, specifically advanced logic, DRAM and advanced packaging. It also said customers say wiring is the bottleneck, and noted that HBM packaging and 3D chiplet stacking are strong growth areas with constrained supply. | Strong AI/data-center demand pulling on leading-edge logic, DRAM, advanced packaging, and wiring complexity. | Leading-edge semiconductor components, advanced logic, DRAM, advanced packaging, HBM packaging, and wiring | Mar 10, 2026 Conference Call | $308.78B |
| $MRVL | Marvell Technology, Inc. | President/COO said: “we've been in a tight supply environment for anything that touches AI, advanced fabrication, advanced packaging…” | Tight supply affects AI-related areas, advanced fabrication, and advanced packaging. | Marvell said it has been in a tight supply environment for anything touching AI, advanced fabrication and advanced packaging since the launch of ChatGPT. It also said interconnect is a bottleneck. | AI-driven demand since ChatGPT and tight supply in advanced fabrication/packaging. | Interconnect, advanced fabrication, and advanced packaging | Mar 5, 2026 Earnings Call | $144.24B |
| $MCHP | Microchip Technology Incorporated | Management said it is “continuing to experience” lead-time increases and “running into challenges on certain kind of substrates and subcontracting capacity and also some foundry constraints on very advanced nodes.” | Explicit bottlenecks include substrates, subcontracted assembly/test, and advanced-node foundry constraints; some lead times have extended. | Microchip said lead times have extended in pockets tied to very advanced process technology, substrates, and back-end assembly and test manufacturing. It also cited foundry constraints on advanced nodes and subcontracting capacity challenges, though it noted most products still have short lead times. | Advanced foundry nodes being full, tighter substrate supply, and constrained subcontracted assembly/test capacity. | Advanced-node foundry capacity, substrates, and back-end assembly/test capacity | Feb 5, 2026 Earnings Call, Feb 11, 2026 Conference Call, Mar 3, 2026 Conference Call, Mar 10, 2026 Conference Call | $50.84B |
